| 摘要 |
Disclosed is a semiconductor device (2) wherein a pad (12), which connects and fixes a conductive wire (14), is formed along the longitudinal direction of the conductive wire (14) in a manner that the pad is tilted from a surface of the semiconductor device (2) at the periphery of the pad (12). Thus, the length of the pad (12) projected on the surface of the semiconductor device (2) is permitted to be shorter than the length of the pad (12) along the surface of the pad. Consequently, an area of a pad region (10) is reduced and an area of an active region (8), which is an effective area wherein the semiconductor structure can be manufactured, is increased. |
