ACTIVE IC CHIP EMBEDDED MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MAKING THE SAME,申请号KR20070117968-传众专利搜索

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发明名称	ACTIVE IC CHIP EMBEDDED MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MAKING THE SAME
摘要
申请公布号	KR20090051529(A)	申请公布日期	2009.05.22
申请号	KR20070117968	申请日期	2007.11.19
申请人	SAMSUNG TECHWIN CO., LTD.	发明人	HONG, SUNG TAIK;JANG, JAE HOON;NA, DUCK HWA
分类号	H05K3/40;H05K3/34	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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