发明名称 LED PACKAGE AND BACK LIGHT UNIT USING THE SAME
摘要 Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
申请公布号 WO2009041767(A3) 申请公布日期 2009.05.22
申请号 WO2008KR05544 申请日期 2008.09.19
申请人 SEOUL SEMICONDUCTOR CO. LTD.;KIM, TAE KWANG;LEE, CHUNG HOON;KIM, DO HYUNG;RYU, SEUNG RYEOL;JEONG, CHAN SUNG;HWANG, WOONG JOON 发明人 KIM, TAE KWANG;LEE, CHUNG HOON;KIM, DO HYUNG;RYU, SEUNG RYEOL;JEONG, CHAN SUNG;HWANG, WOONG JOON
分类号 H01L33/58 主分类号 H01L33/58
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