Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
申请公布号
WO2009041767(A3)
申请公布日期
2009.05.22
申请号
WO2008KR05544
申请日期
2008.09.19
申请人
SEOUL SEMICONDUCTOR CO. LTD.;KIM, TAE KWANG;LEE, CHUNG HOON;KIM, DO HYUNG;RYU, SEUNG RYEOL;JEONG, CHAN SUNG;HWANG, WOONG JOON
发明人
KIM, TAE KWANG;LEE, CHUNG HOON;KIM, DO HYUNG;RYU, SEUNG RYEOL;JEONG, CHAN SUNG;HWANG, WOONG JOON