| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus preventing uneven processing. SOLUTION: A substrate on which a processing layer is formed is supported by a supporting portion to perform a predetermined processing on the substrate, in the substrate processing method. When the predetermined processing is performed, a supporting position of the supporting portion is changed. Since the supporting position of the supporting portion is changed during the predetermined processing, contact positions between the supporting portion and the substrate can be dispersed. Thereby, generation of temperature difference of the substrate by the supporting portion and generation of temperature difference of the substrate by vaporization heat can be minimized, and uneven processing can be prevented. COPYRIGHT: (C)2009,JPO&INPIT
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