| 摘要 |
PROBLEM TO BE SOLVED: To provide a print condition determining method and the like, capable of improving the throughput of a component mounting line even if the tact time of a printer causes a bottleneck. SOLUTION: The method of determining print conditions by a printer 110 for printing a solder on a substrate 120 includes print condition changing steps (S1001-S1011) for gradually changing the print conditions so that a tact time can decrease within a range not exceeding a quality boundary value indicating a boundary capable of maintaining the minimum quality previously defined per print condition for a plurality of print conditions influencing the tact time of the printer 110 and the print quality. COPYRIGHT: (C)2009,JPO&INPIT
|
