发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which prevents the deterioration of sensitivity in a photodetector and which has a passivation film under a micro-lens. SOLUTION: A semiconductor device comprises a semiconductor substrate 100 having a photodetector 101, a silicon oxide film 102 formed on the semiconductor substrate, a plurality of wiring interlayer films 102 which are formed on the silicon oxide film and which contain a wiring layer 103 formed by embedding cooper therein, and silicon nitride films 106 and 110 which are formed on the wiring interlayer film 102a which is the uppermost layer and whose Si-H concentration are less than N-H concentration. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111059(A) 申请公布日期 2009.05.21
申请号 JP20070280304 申请日期 2007.10.29
申请人 TOSHIBA CORP 发明人 OTSUKA MARI;KAMIJO HIROYUKI;HARAKAWA HIDEAKI
分类号 H01L27/14;H01L31/10 主分类号 H01L27/14
代理机构 代理人
主权项
地址