| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in components, capable of materializing high productivity and reduced cost even when one or more kinds of components are mixedly embedded and mounted. <P>SOLUTION: This wiring board with built-in components is equipped with a first insulating layer, a second insulating layer positioned in a laminated shape over the first insulating layer, a semiconductor chip embedded in the second insulating layer while having a terminal pad, a semiconductor element electrically connected to the terminal pad and equipped with surface mounting terminals arranged in a grid shape, electric/electronic components additionally embedded in the second insulating layer, a wiring pattern prepared between the first insulating layer and the second insulating layer while including a first mounting land for the semiconductor element and a second mounting land for the electric/electronic components, a first connecting member for electrically connecting the surface mounting terminal of the semiconductor element to the first mounting land, and a second connecting member made of the same material as that of the first member for electrically connecting the terminals of the electric/electronic components to the second mounting land. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
