| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing TDDB or a short-circuit between adjacent wiring even when the arrangement of via wiring is shifted in an interface direction. SOLUTION: The semiconductor device includes, inside an insulating layer (part composed of 5, 11, 13 and 21) formed on a semiconductor substrate 1, first wiring 7, second wiring 15a disposed above the first wiring 7 and the via wiring 17 connecting the first wiring 7 and the second wiring 15a, and the upper surface S1 of the via wiring 17 is disposed lower than the upper surface S2 of the second wiring 15a. COPYRIGHT: (C)2009,JPO&INPIT
|
