| 摘要 |
PROBLEM TO BE SOLVED: To increase a plating rate in electroless plating, and to prolong the lifetime of a plating solution. SOLUTION: An electroless plating apparatus 10 comprises an electroless plating tank 16 filled with plating solution 16A, and a current-carrying device 20 which carries the current in a conductive metal pattern 12A consisting of a mesh-like thin wire pattern of a laminate 12 to heat the conductive metal pattern 12A during the electroless plating. The current-carrying device 20 has a power supply roller 22 on a cathode side in contact with the conductive metal pattern 12A of the laminate 12 on an inlet side of the electroless plating tank 16, and a power supply roller 24 on an anode side in contact with the conductive metal pattern 12A of the laminate 12 on an outlet side of the electroless plating tank 16. The conductive metal pattern 12A is conducted by the power supply rollers 22, 24, and a part in a vicinity of the conductive metal pattern 12A is heated in the plating solution. COPYRIGHT: (C)2009,JPO&INPIT |
