| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board, capable of connecting the electrode of an electronic component and the connection pad of the wiring board across a solder bump, with high reliability and in electrical terms. <P>SOLUTION: After welding a semispherical solder bump 5 to a first connection pad 3 to which the electrode of the electronic component 6 is connected, the tip end part of a needle-like first measuring terminal 21 for electric inspection is thrusted to the solder bump 5, also a second measuring terminal 22 for the electric inspection is connected to a second connection part 4, and the propriety of the electrical connection between the first connection pad 3 and the second connection pad 4 is decided. Then, the pressing surface of a press tool 31, having the flat press surface, is pressed to the peak part of the solder bump 5, and the peak part of the solder bump 5 is flattened. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
