THERMAL PACKAGING OF TRANSMISSION CONTROLLER USING CARBON COMPOSITE PRINTED CIRCUIT BOARD MATERIAL

摘要

A transmission controller includes a printed circuit board that mechanically supports and electrically connects circuitry of the transmission controller to a vehicle bus. The printed circuit board includes a lower layer of carbon composite and an upper layer of high temperature substrate. A flex circuit is laminated on the printed circuit board to provide an interconnect between the circuitry of the transmission controller and the vehicle bus. The circuitry is encased within a cover. The cover can formed by an overmolding process that encapsulates the circuitry on the upper layer of high temperature substrate or by lamination. The transmission controller can then be attached at a desired location within or on an outer surface of a transmission.