发明名称 CONTROLLING DEVICE FOR SUBSTRATE PROCESSING APPARATUS AND METHOD THEREFOR
摘要 A target value that serves as a control value with feed forward control is optimized. A TL performs a feed forward and a feedback control of a PM. A storage unit stores a plurality of recipes indicating different processing sequences, and a target value that serves as a control value when performing an etching process. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer processed in the current cycle, based on pre-processing and post-processing measurement information for the wafer. An update unit updates the target value using the feedback value. A recipe adjustment unit changes the recipe to change the process performed in the same PM. When the process is performed after changing, the updated target value is used to perform feed forward control of the wafer in the same PM.
申请公布号 US2009132078(A1) 申请公布日期 2009.05.21
申请号 US20070874626 申请日期 2007.10.18
申请人 TOKYO ELECTRON LIMITED 发明人 SAKANO SHINJI
分类号 G06F19/00;H01L21/02;H01L21/205;H01L21/3065 主分类号 G06F19/00
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