| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of mounting a larger number of semiconductor chips and circuit members such as an electronic component, and its manufacturing method. <P>SOLUTION: A cover-like portion is formed on the other side of first to n-th semiconductor chips by mounting the first semiconductor chip and at least one circuit member on a substrate, laminating the second semiconductor chip on the first semiconductor chip in a state in which the second semiconductor chip is horizontally shifted in one direction and a portion of the first semiconductor chip is exposed as an exposed portion on one side, and laminating the third to n-th semiconductor chips in order in a state in which an upper side semiconductor chip is horizontally shifted from a lower side semiconductor chip in one direction in order and the exposed portion of the lower side semiconductor chip is exposed on one side. The cover-like portion covers the circuit member. <P>COPYRIGHT: (C)2009,JPO&INPIT |
