LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a light emitting diode package and a method for fabricating the same.

SOLUTION: An LED package includes a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is provided on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is provided on the bottom surface of the submount and spreads heat from the submount, and a lens is formed directly over the LED.

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