| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a cured product having favorable solvent resistance, and to provide an electronic component containing the cured product of the curable resin composition. <P>SOLUTION: The curable resin composition comprises a polyamide-imide resin, an epoxy resin and a curing accelerator, wherein the product, in which the amount dissolved in N-methyl-2-pyrrolidone at 25°C is ≤3.0 g per 1 m<SP>2</SP>of a surface area, is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
