| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is developed with a mildly alkaline aqueous solution to obtain high mechanical strength upon heating at a low temperature. <P>SOLUTION: The photosensitive resin composition contains a polyamic acid containing a molecular chain end which is a structure of general formula (1) and having a reduced molecular weight, and a photosensitive agent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
