| 摘要 |
PROBLEM TO BE SOLVED: To improve thermal resistance and thermal shock resistance by raising adhesion between the pattern of an inner layer and the insulating material of an outer layer. SOLUTION: When manufacturing the inner layer 10a of a multilayered printed wiring board having three or more pattern layers in its thickness direction, following treatments are performed. A current carrying layer 13 made of a metal coat is formed on the surface of a base material 11 made of the insulating material. Subsequently, a plated resist 21a is formed in a portion other than a pattern forming portion on the current carrying layer. Then, a pattern 14 is formed in the pattern forming portion other than the plated resist 21a by electrolytic plating using the current carrying layer 13. A rough coat 15 is formed on the surface of the pattern 14 formed by a pattern forming process by forming a dendritic electrodeposition layer and a mat plated layer in turn, The plated resist 21a and the current carrying layer 13 below the plated resist 21a are removed. The inner layer 10a is thus manufacture. COPYRIGHT: (C)2009,JPO&INPIT |
