发明名称 |
Memory module, socket and mounting method providing improved heat dissipating characteristics |
摘要 |
In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.
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申请公布号 |
US2009130908(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20080318386 |
申请日期 |
2008.12.29 |
申请人 |
PARK SANG-WOOK;BAEK JOONG-HYUN;LEE HAE-HYUNG;CHOI HEE-KOOK;LEE JIN-YANG |
发明人 |
PARK SANG-WOOK;BAEK JOONG-HYUN;LEE HAE-HYUNG;CHOI HEE-KOOK;LEE JIN-YANG |
分类号 |
H01L23/50;H01R24/00;H01R13/62;H05K3/30 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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