发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM AND RESIN PATTERN USING THOSE
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is developed with a mildly alkaline aqueous solution to obtain high mechanical strength upon heating at a low temperature. <P>SOLUTION: The photosensitive resin composition contains (A) an alkali-soluble resin having a reactive group at a molecular chain end, (B) an organic compound having two moieties capable of linking up with the reactive group, and (C) a photosensitive agent. A photosensitive dry film and a coverlay using those are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009109588(A) 申请公布日期 2009.05.21
申请号 JP20070279501 申请日期 2007.10.26
申请人 ASAHI KASEI CORP 发明人 HAYAKAWA TAKASHI;TAKAHASHI HIDEAKI
分类号 G03F7/023;G03F7/004;H01L21/027;H05K3/28 主分类号 G03F7/023
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