发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM AND RESIN PATTERN USING THOSE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is developed with a mildly alkaline aqueous solution to obtain high mechanical strength upon heating at a low temperature. <P>SOLUTION: The photosensitive resin composition contains (A) an alkali-soluble resin having a reactive group at a molecular chain end, (B) an organic compound having two moieties capable of linking up with the reactive group, and (C) a photosensitive agent. A photosensitive dry film and a coverlay using those are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009109588(A) |
申请公布日期 |
2009.05.21 |
申请号 |
JP20070279501 |
申请日期 |
2007.10.26 |
申请人 |
ASAHI KASEI CORP |
发明人 |
HAYAKAWA TAKASHI;TAKAHASHI HIDEAKI |
分类号 |
G03F7/023;G03F7/004;H01L21/027;H05K3/28 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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