发明名称 MANUFACTURING METHOD OF ALUMINUM-BASED RADIATING SUBSTRATE FOR ELECTRIC CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a metal-based radiating substrate for electric circuit, which is low in cost and high in reliability, by forming an insulating film, excellent in chemical resistance and insulating characteristic. SOLUTION: In the manufacturing method of the radiating substrate for electric circuit wherein a metal sheet layer is formed by the vapor growth method on the surface of the aluminum substrate, on which the insulating film is formed by anodization, and, thereafter, a metal film is formed by electroplating, the aluminum substrate processed by anodization is immersed in a polyimide varnish solution, adjusted so that the amount of resin is 1-10 wt.%, for not less than 5 minutes whereby the polyimide resin is filled into the pores of the insulating film. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111249(A) 申请公布日期 2009.05.21
申请号 JP20070283641 申请日期 2007.10.31
申请人 SUMITOMO METAL MINING CO LTD 发明人 SUGAMOTO NORIAKI
分类号 H05K3/44;C25D11/18;H01L23/12;H01L23/36 主分类号 H05K3/44
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