发明名称 MOLDING DIE AND MOLDING PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a molding die and a molding method which improve packing in the flow hindering part by a relatively simple mold structure when a molding having a narrow flow hindering part is molded. SOLUTION: In the molding die 21 for molding the molding having the narrow flow hindering part 35, the flow hindering part 35 in a cavity 24a of the molding die 21 is formed to be incompressible, and core blocks 26a for compressing a molten resin injected in the cavity 24a are set between the flow hindering part 35 and gate parts 30 and 54. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009107224(A) 申请公布日期 2009.05.21
申请号 JP20070282036 申请日期 2007.10.30
申请人 MEIKI CO LTD 发明人 EBINA TOSHIYUKI
分类号 B29C45/56;B29C45/26 主分类号 B29C45/56
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