发明名称 |
Manufacturing method of semiconductor device |
摘要 |
A method of manufacturing a semiconductor device includes the steps of bonding a semiconductor chip to a first side of a circuit board, bonding a metal base for dissipating heat produced by the semiconductor chip to a second side of the circuit board, and forming a dam on the metal base by a dam material so as to restrict flow of a solder used in bonding a plurality of the circuit boards to the metal base.
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申请公布号 |
US2009130800(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20090320028 |
申请日期 |
2009.01.15 |
申请人 |
FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD. |
发明人 |
TOBA SUSUMU;MOROZUMI AKIRA;FURIHATA KAZUO |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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