发明名称 |
CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PROCESS THEREOF |
摘要 |
A chip package structure and process are provided; the structure includes a substrate, a chip, a solder layer and at least a stud bump. The substrate has at least a contact pad, and the chip has an active surface where at least a bonding pad is disposed. The stud bump is disposed on the bonding pad of the chip or on the contact pad of the substrate, and the stud bump joints with the solder layer to fix the chip on the substrate. The stud bump is made of gold-silver alloy containing silver below 15% by weight. |
申请公布号 |
US2009127706(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20080248562 |
申请日期 |
2008.10.09 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
SHEN CHI-CHIH;CHEN JEN-CHUAN;CHANG HUI-SHAN;PAN TOMMY |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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