| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board whose reflection loss is reduced by making mismatching of characteristic impedance small at a connection point of through conductors with each other in the multilayer wiring board having the through conductors and transmission lines needing microfabrication. <P>SOLUTION: The through conductors 5 formed in the multilayer wiring board and ground through conductors 6 surrounding the through conductors 5 concentrically are formed such that parts whose diameters gradually become small and parts whose diameters gradually become large are alternately repeated from one side to the other side. Since no sudden change in a characteristic impedance occurs at the connection point between the through conductors 5, reflection loss of a high frequency signal can be made small. <P>COPYRIGHT: (C)2009,JPO&INPIT |
