| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate support member for a chemical and mechanical polishing (CMP) apparatus capable of improving an yield of a device manufactured on a substrate by reducing an influence of contact between the substrate and the substrate support member to the manufacturing of the device, and to provide the CMP device. <P>SOLUTION: A pedestal (substrate support member) 12 for the CMP device is incorporated in a mechanism which passes and receives the substrate to and from a carrier bed in the CMP device to support the substrate. The pedestal 12 has an annular section 13 having an annular support surface 16 for supporting the peripheral edge of the plate surface of the substrate, and the annular section 13 has a cavity peripherally extending in the annular section 13 and a plurality of suction holes 17 formed one after another from the cavity in the peripheral direction of the annular section 13 to be opened on the support surface 16, and sucking the substrate and injecting a cleaning liquid to the carrier head. <P>COPYRIGHT: (C)2009,JPO&INPIT |
