发明名称 |
Semiconductor package and manufacturing method thereof |
摘要 |
<p>A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.</p> |
申请公布号 |
AU2004268299(B2) |
申请公布日期 |
2009.05.21 |
申请号 |
AU20040268299 |
申请日期 |
2004.08.25 |
申请人 |
OLYMPUS CORPORATION;FUJIKURA LTD. |
发明人 |
SATOSHI YAMAMOTO;KOICHI SHIOTANI;KAZUYA MATSUMOTO;SAYAKA HIRAFUNE;TATSUO SUEMASU;TOSHIHIKO ISOKAWA |
分类号 |
H01L23/48;H01L23/12;H01L23/538;H01L25/065;H01L29/76 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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