发明名称 JOINING METHOD OF PLATE MATERIAL TO GLASS SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a joining method capable of joining a substrate made of material having a coefficient of linear thermal expansion different from that of a glass substrate, for example a metallic substrate to the glass substrate without generating deformation caused by difference in thermal expansion, appropriately utilized especially in the manufacture of a dye-sensitized solar cell. <P>SOLUTION: In the method joining a metallic substrate 11 having the coefficient of thermal expansion different from that of a glass substrate 10 to the glass substrate 10, a thermoplastic resin layer 13 is formed on the surface of the metallic substrate 11, and while the glass substrate 10 is pressed against the metallic substrate 11 in such a state that the thermoplastic resin layer 13 is interposed between them, and the thermoplastic resin layer 13 is melt-bonded to the surface of the glass substrate 10 by noncontact heating of laser light irradiation. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009110663(A) 申请公布日期 2009.05.21
申请号 JP20070278311 申请日期 2007.10.26
申请人 TOYO SEIKAN KAISHA LTD 发明人 TAKEUCHI KIMIO;TATSUMI SHIGETAKA;SATO KAZUHIRO
分类号 H01M14/00;H01L31/04;H01M2/08 主分类号 H01M14/00
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