| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device suppressing occurrence of a sealing resin crack between a die pad and an inner lead. <P>SOLUTION: An end (inner lead bending part 3a) of the inner lead 3 and an end (die pad bending part 2a) of the die pad 2 are bent in opposite directions. A distance between the inner lead 3 and the die pad 2 is extended. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
