| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip manufactured by a manufacturing method including a step of cutting a semiconductor substrate through a dicing process using laser light, the semiconductor chip being capable of preventing a fine fragment in a reformed region from peeling off the cut surface of a semiconductor chip, and to provide the method of manufacturing the same. SOLUTION: In an etching step after cutting a wafer 21, a semiconductor substrate 21 having been cut into a semiconductor chip 22 is disposed in a chamber for performing isotropic dry etching in a state that the substrate 21 is stuck on a sheet 411. Then XeF<SB>2</SB>as a reactive gas is introduced to etch the semiconductor substrate under predetermined conditions. Consequently, isotropic etching is carried out on the cut surface 21d to remove the reformed region K, so the reformed region K is prevented from scattering as a fine fragment. Because of the dry process, there is no risk of causing the sticking on the movable portion of an MEMS 23 due to surface tension of liquid. COPYRIGHT: (C)2009,JPO&INPIT
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