发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor substrate where a stable and uniform protective film is formed on a semiconductor surface by improving the treatment liquid. SOLUTION: The manufacturing method of the semiconductor substrate includes a process of introducing the treatment liquid, containing a micro nano valve into a treatment tank, and a process of dipping the semiconductor substrate in the treatment liquid to form the protective film on the semiconductor substrate surface. The treatment liquid containing this micro nano valve is produced by a micro nano valve water producing device, provided to a semiconductor substrate treatment apparatus, prior to the treatment on the semiconductor substrate and is introduced into the treatment tank. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111093(A) 申请公布日期 2009.05.21
申请号 JP20070280904 申请日期 2007.10.29
申请人 COVALENT MATERIALS CORP 发明人 SENDA TAKESHI;ISOGAI HIROMICHI;SENSAI KOJI;NABEYA KOICHI
分类号 H01L21/316;H01L21/304 主分类号 H01L21/316
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