| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a silicone substrate for package, which prevents the occurrence of disconnection between a through electrode and thin film wiring at a base of a cavity. <P>SOLUTION: The silicone substrate 10 for package includes through electrodes 14 with which through-holes 12 passing to a backside of the substrate 10 from the base 16B of the cavity storing an electronic device chip are filled. An end on a cavity base 16B-side of the through electrode 14 has a connecting part with wiring constituting an electric circuit comprising the electronic device chip. (1) The substrate includes thin film wiring 20 as wiring and the connecting part is reinforced by a conductor bonded to thin film wiring 20, and/or (2) the substrate includes a wire bonding part as wiring and the connecting part is formed by wire bonding with the end on the cavity base 16B-side of the through electrode 14. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
