| 摘要 |
PROBLEM TO BE SOLVED: To suppress a local temperature rise of a key part in a mobile equipment at which a plurality of keys are installed. SOLUTION: A PDA as the mobile equipment is equipped with a substrate 20, an exothermic semiconductor element 30 installed at the first main surface S1 of the substrate 20, a plurality of switches 22 installed at the second main surface S2 of the substrate 20, a key mat 40 positioned on the second main surface S2 side of the substrate 20, a plurality of protruding parts 42 to respectively protrude toward the plurality of switches 22 from the one main surface of the key mat 40 opposing to the second main surface A2 of the substrate 20, and a key 16 which is positioned on the other main surface side of the key mat 40, and which can be pushed down against the key mat 40. Between the key mat 40 and the key 16, a space 80 is installed such that the key 16 is embedded by depression of the key 16, which is contactable with the key mat 40. COPYRIGHT: (C)2009,JPO&INPIT
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