| 摘要 |
PROBLEM TO BE SOLVED: To suppress a local temperature rise of a key part in a mobile equipment at which a plurality of keys are installed. SOLUTION: A PDA as the mobile equipment is equipped with a substrate 20, an exothermic semiconductor element 30 installed at a first main surface S1 of the substrate 20, a plurality of switches 22 installed at a second main surface S2 of the substrate 20, a key mat 40 positioned on the second main surface S2 side of the substrate 20, a plurality of protruding parts 42 protruded toward the plurality of respective switches 22 from one main surface of the key mat 40 opposing to the second main surface S2 of the substrate 20, and a key 16 which is installed at the other main surface of the key mat 40 and can be depressed against the key mat 40. A contact face of a specified switch 22a of which the distance from the semiconductor element 30 in a surface direction of the substrate is within a prescribed range with the protruding part 42a protruded toward this has a smaller area compared with the contact face of an unspecified switch 22b except the specified switch 22a with the protruding part 42b protruded toward this. COPYRIGHT: (C)2009,JPO&INPIT
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