| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic polishing method of a substrate by which dishing or erosion can be reduced without causing damage to an insulating film such as a Low-k film. SOLUTION: The electrolytic polishing method of a substrate includes setting a substrate 1A, 1B having a barrier film 3 and a wiring metal layer 4 on a surface to be processed to be a cathode, then applying a voltage between the surface to be processed and an anode, and relatively moving the surface to be processed and a polishing pad, oppositely coming into contact with the surface to be processed, to remove the barrier film 3. COPYRIGHT: (C)2009,JPO&INPIT
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