发明名称 POLYAMIDE RESIN COMPOSITION FOR CASING OF ELECTRICAL/ELECTRONIC EQUIPMENT AND CASING OF ELECTRICAL/ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition that has high stiffness, thin-wall moldability, radio communication capability and flame retardancy at the same time for use in a specific casing of electrical/electronic equipment produced by integrating a structure comprising a radio wave shielding material with a structure comprising the polyamide resin composition, i.e., a casing of electrical/electronic equipment having both an electromagnetic wave shielding property and radio communication capability. SOLUTION: The polyamide resin composition for a casing of electrical/electronic equipment contains (A) 15-60 wt.% polyamide resin comprising (A1) a terpolymer and (A2) a polyamide resin other than the terpolymer (A1), (B) 35-65 wt.% glass fiber, (C) 3-10 wt.% red phosphorus and (D) 2-10 wt.% magnesium hydroxide, based on 100 wt.% polyamide resin composition wherein the terpolymer (A1) is a terpolymer consisting of (A1a) a hexamethylene adipamide unit, (A1b) a hexamethylene isophthalamide unit and (A1c) a caproamide unit. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009108221(A) 申请公布日期 2009.05.21
申请号 JP20070282866 申请日期 2007.10.31
申请人 TORAY IND INC 发明人 TOGAWA MITSUNARI;HATSU TOSHIHIRO
分类号 C08L77/00;C08K3/20;C08K3/32;C08K7/14 主分类号 C08L77/00
代理机构 代理人
主权项
地址