发明名称 HEAT-TREATING APPARATUS, HEAT-TREATING METHOD AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To rapidly cool a heating plate for heating a substrate even in the case that a cooling gas is at a low flow rate when the heating plate is cooled. SOLUTION: A straightening plate provided at its inner circumference with a gas exhaust opening is disposed under the heating plate. In addition, a tube-shaped temperature-reducing purge ring having an outside diameter substantially equal to that of the straightening plate is disposed between the heating plate and the straightening plate, and provided at its inner circumference with many gas jetting holes. When a gap between the lower edge of the heating plate and the upper edge of the temperature-reducing purge ring is narrowed, and a cooling gas is jetted inward from the temperature-reducing purge ring, the lower surface of the heating plate has negative pressure, and a large amount of air flows from the outside. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111343(A) 申请公布日期 2009.05.21
申请号 JP20080210967 申请日期 2008.08.19
申请人 TOKYO ELECTRON LTD 发明人 SAKAI YUICHI;YAMAGUCHI KIYOMITSU
分类号 H01L21/027 主分类号 H01L21/027
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