发明名称 |
CAMERA MODULES AND METHODS OF FABRICATING THE SAME |
摘要 |
Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.
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申请公布号 |
US2009130791(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20080274642 |
申请日期 |
2008.11.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON WOON-SEONG;CHO TAE-JE;KWON YONG-HWAN;KANG UN-BYOUNG;LEE CHUNG-SUN;JANG HYUNG-SUN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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地址 |
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