发明名称 |
Power module and method of fabricating the same |
摘要 |
Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.
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申请公布号 |
US2009129028(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20080220638 |
申请日期 |
2008.07.24 |
申请人 |
SON JOON-SEO;LIM SEUNG-WON;JEON O-SEOB |
发明人 |
SON JOON-SEO;LIM SEUNG-WON;JEON O-SEOB |
分类号 |
H05K7/20;H01L21/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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