发明名称 Power module and method of fabricating the same
摘要 Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.
申请公布号 US2009129028(A1) 申请公布日期 2009.05.21
申请号 US20080220638 申请日期 2008.07.24
申请人 SON JOON-SEO;LIM SEUNG-WON;JEON O-SEOB 发明人 SON JOON-SEO;LIM SEUNG-WON;JEON O-SEOB
分类号 H05K7/20;H01L21/00;H01L23/34 主分类号 H05K7/20
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