发明名称 RESIN FILM FORMATION METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To increase adhesive strength between a resin film and an adhesive agent upon patching a resin film to a substrate material via an adhesive agent. <P>SOLUTION: The resin formation method comprises a resin film manufacturing process, etc., a flow casting process, a coating process and a heating process. In the resin film manufacturing process, a resin film 11, etc. having a predetermined thickness is manufactured from a first resin, etc. solution 1 containing a resin and/or a resin precursor, in the flow casting process, a second resin, etc. solution 1 containing the same resin and/or resin precursor with those contained in the first resin, etc. solution is casted in a predetermined thickness on a substrate material 2 or a resin, etc. film, in the coating process, a resin, etc. film or a substrate material is coated on the second resin, etc. solution without drying the second resin, etc. solution is casted on the substrate material or the resin, etc. film, and in the heating process, the second resin, etc. solution and the resin, etc. film are heated. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009107291(A) 申请公布日期 2009.05.21
申请号 JP20070284195 申请日期 2007.10.31
申请人 DAIKIN IND LTD 发明人 MOCHIZUKI OSAMU;SATO NAOYUKI;OKAWA TAKEYOSHI;I HISASHI
分类号 B32B37/00;B29C65/52;B29L9/00;C09J5/06;C09J201/00 主分类号 B32B37/00
代理机构 代理人
主权项
地址