发明名称 CIRCUIT ARRANGEMENT
摘要 PROBLEM TO BE SOLVED: To provide a circuit arrangement capable of reducing influence of heat generation on a printed board when large current flows in BATT wiring and GP wiring provided in the printed board respectively. SOLUTION: Each switching device 30 is placed between a battery terminal 43 and GP terminals 44 so that the one side surface of each switching device 30 may face a straight line 80 extending in vertical to one direction in which the battery terminal 43 and the GP terminals 44 are placed. Under this constitution, the BATT wiring 60 is placed on the battery terminal 43 side, and the GP wiring 70 is placed on the GP terminals 44 side, thus forming an arrangement relation not interposing a part of the printed board 40 between the BATT wiring 60 and the GP wiring 70. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009108719(A) 申请公布日期 2009.05.21
申请号 JP20070280113 申请日期 2007.10.29
申请人 DENSO CORP 发明人 HAYASHI MASATO
分类号 F02P19/02;H01L25/07;H01L25/18 主分类号 F02P19/02
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