发明名称 |
SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT |
摘要 |
A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead-free solder is used.
|
申请公布号 |
US2009127695(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20070942404 |
申请日期 |
2007.11.19 |
申请人 |
KIM PATRICK;KUHLMAN MARK A;GUO YIFAN;LOBIANCO ANTHONY;WARREN ROBERT W |
发明人 |
KIM PATRICK;KUHLMAN MARK A.;GUO YIFAN;LOBIANCO ANTHONY;WARREN ROBERT W. |
分类号 |
H01L23/48;H01L21/02;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|