| 摘要 |
A bonding device and method for producing a bonding connection is disclosed. One embodiment provides a bonding stamp and an ultrasonic generator coupled thereto. The ultrasonic frequency and an effective length, which is given by the distance between the lower end of the bonding stamp and the coupling location of the ultrasonic generator at the bonding stamp in the vertical direction, are coordinated with one another in such a way that the following holds true: <maths id="MATH-US-00001" num="00001"> <math overflow="scroll"> <mrow> <mrow> <mn>0.9</mn> <mo>.</mo> <mi>n</mi> <mo>.</mo> <mfrac> <mi>c</mi> <mrow> <mn>2</mn> <mo>.</mo> <mi>l</mi> </mrow> </mfrac> </mrow> <mo><=</mo> <mi>f</mi> <mo><=</mo> <mrow> <mn>1.1</mn> <mo>.</mo> <mi>n</mi> <mo>.</mo> <mfrac> <mi>c</mi> <mrow> <mn>2</mn> <mo>.</mo> <mi>l</mi> </mrow> </mfrac> </mrow> </mrow> </math> </maths> where c is the speed of the ultrasound in the bonding stamp at the frequency f, and n=1 or 2 or 3 or 4. |
