发明名称 |
FLEXIBLE HALOGEN-FREE EPOXY RESIN COMPOSITION, METALLIC FOIL WITH RESIN, COVER-LAY FILM, PREPREG, LAMINATE FOR PRINTED WIRING BOARD, METAL-CLAD FLEXIBLE LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible halogen-free epoxy resin composition ensuring demanded flame retardancy without using halogen and satisfying adhesiveness, electrical insulation reliability, heat resistance, and flexibility required in application for a flexible printed wiring board and the like. SOLUTION: The flexible halogen-free epoxy resin composition comprises a component A and one or both of components B and C. A mixing total amount of the components B and C is 30-50 mass% based on the total amount of the flexible halogen-free epoxy resin composition. The component A is a naphthalene-skeleton epoxy resin. The component B is a block copolymer type thermoplastic resin and the like consisting of a soft component and a rigid component. The component C consists of a soft thermoplastic resin and the like C1 with Tg of lower than 25°C and a rigid thermoplastic resin and the like C2 with Tg of 25°C or higher. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009108144(A) |
申请公布日期 |
2009.05.21 |
申请号 |
JP20070279680 |
申请日期 |
2007.10.26 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
KOSEKI TAKAYOSHI;EZAKI YOSHIAKI;OKUNO SHINJI;ISHIKAWA YOSUKE;KATO TETSUYA |
分类号 |
C08L63/00;B32B15/08;B32B15/092;C08G59/24;C08G59/62;C08J5/24;C08K5/49;C08L53/00;C08L101/12;C09J11/00;C09J153/00;C09J163/00;H05K1/03;H05K3/28 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|