发明名称 FLEXIBLE HALOGEN-FREE EPOXY RESIN COMPOSITION, METALLIC FOIL WITH RESIN, COVER-LAY FILM, PREPREG, LAMINATE FOR PRINTED WIRING BOARD, METAL-CLAD FLEXIBLE LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a flexible halogen-free epoxy resin composition ensuring demanded flame retardancy without using halogen and satisfying adhesiveness, electrical insulation reliability, heat resistance, and flexibility required in application for a flexible printed wiring board and the like. SOLUTION: The flexible halogen-free epoxy resin composition comprises a component A and one or both of components B and C. A mixing total amount of the components B and C is 30-50 mass% based on the total amount of the flexible halogen-free epoxy resin composition. The component A is a naphthalene-skeleton epoxy resin. The component B is a block copolymer type thermoplastic resin and the like consisting of a soft component and a rigid component. The component C consists of a soft thermoplastic resin and the like C1 with Tg of lower than 25°C and a rigid thermoplastic resin and the like C2 with Tg of 25°C or higher. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009108144(A) 申请公布日期 2009.05.21
申请号 JP20070279680 申请日期 2007.10.26
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 KOSEKI TAKAYOSHI;EZAKI YOSHIAKI;OKUNO SHINJI;ISHIKAWA YOSUKE;KATO TETSUYA
分类号 C08L63/00;B32B15/08;B32B15/092;C08G59/24;C08G59/62;C08J5/24;C08K5/49;C08L53/00;C08L101/12;C09J11/00;C09J153/00;C09J163/00;H05K1/03;H05K3/28 主分类号 C08L63/00
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