发明名称 SUBSTRATE-THROUGH WAVEGUIDE
摘要 PROBLEM TO BE SOLVED: To provide a substrate-through waveguide which enhances a reflection property without plating a substrate opening end face or the vicinity thereof. SOLUTION: The substrate-through waveguide is configured by holding both sides of a circuit board 10, on which a plurality of VIA holes 14 are formed around a substrate opening 11 at intervals sufficiently smaller than a wavelength, between two waveguides 20, 30 comprising waveguide openings 21, 31. Then, a distance L1 between end faces 21a, 31a of the waveguide openings 21, 31 and an end face 14a of the VIA holes 14 and a distance L2 between the end faces 21a, 31a of the waveguide openings 21, 31 and an end face 11a of the substrate opening 11 are set so as to satisfy the relation of 0.4<L2/L1<1.7. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111837(A) 申请公布日期 2009.05.21
申请号 JP20070283376 申请日期 2007.10.31
申请人 JAPAN RADIO CO LTD 发明人 YOSHIDA GORO;MIURA YOHEI
分类号 H01P1/04;H01P3/12;H05K1/02 主分类号 H01P1/04
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