发明名称 |
SEMICONDUCTOR PROCESSING SYSTEM AND METHOD OF PROCESSING A SEMICONDUCTOR WAFER |
摘要 |
A method of processing semiconductor wafers includes applying reactive gas through a plurality of inlets to the semiconductor wafers. The method further includes removing exhaust gas resulting from the step of applying reactive gas. The removing of the exhaust gas is through a plurality of outlets coupled to a manifold. The manifold combines the exhaust gas from the plurality of outlets. The method further includes measuring a pressure in each outlet of the plurality of outlets during the step of removing.
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申请公布号 |
US2009130780(A1) |
申请公布日期 |
2009.05.21 |
申请号 |
US20070941564 |
申请日期 |
2007.11.16 |
申请人 |
DAY ROBERT M;LOPEZ PAUL E |
发明人 |
DAY ROBERT M.;LOPEZ PAUL E. |
分类号 |
H01L21/66;C23C16/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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