发明名称 HEAT PUMP DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive heat pump device while significantly reducing the cost of an evaporator and minimizing degradation of performance. <P>SOLUTION: This heat pump device comprises a refrigerant circuit constituted by annularly connecting a compressor 11, a radiator 12, a pressure reducing device 13 and the evaporator 14 absorbing heat from the atmospheric air by refrigerant pipes, and a fan 19 disposed at a leeward side of the evaporator 14, the evaporator 14 is composed of a fin tube heat exchanger having a heat transfer tube, and plate fins composed of one row at a windward side and two rows at a leeward side, and a height from a base on which the evaporator is disposed to a lowermost end of the leeward-side one row, is more than a height of a leeward-side resisting substance at the leeward side of the evaporator. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009109050(A) 申请公布日期 2009.05.21
申请号 JP20070279886 申请日期 2007.10.29
申请人 PANASONIC CORP 发明人 SHIRAI KENJI;AOYANAGI OSAMU;HAMADA MASAYUKI
分类号 F25B39/02;F24H1/00;F24H9/00 主分类号 F25B39/02
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