发明名称 MOLD FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold for injection molding which uniformly cools a molded article to thereby reduce temperature difference in the molded article to <1°C in a short period of cooling time. SOLUTION: An interval between a mold base body surface and a nesting surface is supported by a plurality of column supports (7) and the interval is used as a heating medium flow passage (8) to thereby increase the surface area of the heating medium flow passage compared to that of conventional piping structure. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009107307(A) 申请公布日期 2009.05.21
申请号 JP20070284631 申请日期 2007.11.01
申请人 PANASONIC CORP 发明人 TABATA DAISUKE;ISOMI AKIRA;NAKA HIROYUKI;KUBO FUTOSHI
分类号 B29C45/26;B29C33/04;B29L11/00 主分类号 B29C45/26
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