发明名称 WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board in which not only the cost for forming the means for connection between upper and lower circuit conductors can be reduced and which is adaptable to production of a wide variety of products with small volume for each, but also the production of a narrow variety of products with large volume for each, by enhancing the productivity of the wiring circuit board that possesses different circuit conductor patterns, depending on the product model. SOLUTION: The wiring circuit board uses a number of metal protrusions 53, 57 which penetrates an interlayer insulating film interposed between metal layers, as the means for connection between upper and lower conductors, wherein the protrusions 53, 57 for connection between upper and lower conductors are positioned at the respective crossing points of a lattice arranged at fixed intervals. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009111417(A) 申请公布日期 2009.05.21
申请号 JP20090004415 申请日期 2009.01.13
申请人 TESSERA INTERCONNECT MATERIALS INC 发明人 IIJIMA ASAO;OSAWA MASAYUKI
分类号 H05K3/40;H05K1/02;H05K1/11 主分类号 H05K3/40
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