| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connecting material which can be cured even at low temperature equal to or less than 150°C and provides sufficient connection strength for connection of OSP processed substrates, and to provide a connection structure for circuit member using the same. SOLUTION: Disclosed is a circuit connecting material 1 for electrically connecting circuit electrodes facing each other, which contains (1) a curing agent generating a free radical, (2) a radically polymerizable substance, and (3) a polyamideimide resin having a structural unit represented by general formula (I). In the formula (I), R<SP>1</SP>and R<SP>2</SP>independently represent an alkylene group having 1-18 carbon atoms; X<SP>1</SP>and X<SP>2</SP>independently represent an arylene group or an alkylene group having 1-18 carbon atoms; m and n independently represent an integer of 1-20; and Y represents a trivalent organic group. COPYRIGHT: (C)2009,JPO&INPIT
|
