发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an accomodation apparatus and a lead-in passage forming assembly of wiring/piping materials that enables a smooth and easy installation, accommodation in sequence without scratching a plurality of wiring/piping materials. <P>SOLUTION: The accomodation apparatus of wiring/piping materials includes a lead-in passage through which wiring/piping materials are led, and an accommodating passage for accommodating the wiring/piping materials in longitudinal direction. The lead-in passage and the accommodating passage are formed with being partitioned from each other, as well as provided so as to form a movement space where the wiring/piping materials that have been led into the lead-in passage can move into the accommodating passage. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP4264665(B2) 申请公布日期 2009.05.20
申请号 JP20060341136 申请日期 2006.12.19
申请人 发明人
分类号 H02G3/00;F16L3/00 主分类号 H02G3/00
代理机构 代理人
主权项
地址